Power Discrete Packaging Comparison – 2018 Complete Teardown Report with Forecasts to 2022

Power Discrete Packaging Comparison - 2018 Complete Teardown Report with Forecasts to 2022
Power Discrete Packaging Comparison - 2018 Complete Teardown Report with Forecasts to 2022

DUBLIN, July 25, 2018 /PRNewswire/ —

The “Power Discrete Packaging Comparison 2018 Complete Teardown Report” report has been added to ResearchAndMarkets.com’s offering.

The most recent market forecast by the publisher shows the global rise of power devices. The market for discrete devices will follow that trend, increasing in value by an estimated $1.5 billion in the next five years.

In recent years the packaging market industry has stabilized around some standard formats and footprints. But the race for optimization is far from over.

The electric and hybrid electric vehicle markets are evolving fast, as are other aspects of electrification of transportation. This, and more generally the power electronic market’s growth, has induced competition between component manufacturers.

In the race to innovation and efficiency, the semiconductor die itself isn’t the only key to success. In fact, when chasing after the optimum configuration for electrical, thermal and mechanical performance, manufacturers also must battle with the mechanical reliability and cost of packaging. More than a simple shell, the packaging surrounding the dies can make or break a design.

To satisfy an industry where standardization and return on experience’ are key elements of success, seemingly small but smart tweaks around common packages can turn out to be highly differentiating.

Through physical analyses, including chemical opening, cross-sections, and various measurements, this report tries to summarize the state of the art of packaging power semiconductors at a discrete level. With a cost-oriented viewpoint, we reveal the hidden details that make the difference between over 20 types of packages, ranging from mW to kW designs.

Key Topics Covered:

1. Overview/Introduction

Executive Summary

Reverse Costing Methodology

Devices Analyzed

2. Introduction

Discrete Market

3. Physical Analysis

  • 3x3mm
  • SON3x3
  • TSMT8
  • 4.52.5mm
  • SOT89
  • SOIC-8
  • 5x6mm
  • PowerFLAT 56
  • PowerFLAT 56 double island
  • PowerFLAT 56 dual side cooling
  • SOP advance
  • 10x10mm
  • D2PAK7
  • H2PAK
  • PSOFA-008
  • TO-220

4. Manufacturing process flow

5. Cost Simulation

6. Comparison

For more information about this report visit https://www.researchandmarkets.com/research/pdrlh4/power_discrete?w=5

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